Configuration |
6”/ 8”wafer ==> CCD ==> Electric Test ==> Sorting |
Dimensions |
LxWxH:2230mm x 1310mm x 1810mm |
Applicable Packages |
Die 30~220mil |
Wafer Table Input & Pickup Tolerances |
6 & 8 Inch (DTF 2-6-1 / 2-8-1 Metal Frames) |
θ: +/- 3° |
|
Electric Test System |
2 Test Stations (4 Contacts, 2 on top & bottom) |
Sorting Boxes |
12 Boxes (Bin 1 ~ Bin 12) |
CCD Systems |
Wafer Table Pickup CCD (5MP) |
Bottom Side CCD (5MP) |
|
Run Speed |
≧20k/hr. (Variable Package Size) |