Configuration |
Tray ==> Inspection ==> Electric Test ==> Tray |
Wafer ==> Inspection ==> Electric Test ==> Tray |
|
Dimension |
LxWxH:1300mm x 1100mm x 1900mm |
Applicable Packages |
Die 10~110mil (Optional: 10 ~ 330mil) |
Wafer Table Input & Pickup Tolerances |
6 Inch (DTF 2-6-1 Metal Frames) |
θ: +/- 3° |
|
Electric Test System |
1 Test Station (4 Contacts, 2 on top & bottom) |
CCD Systems |
Wafer Table Pickup CCD (5MP) |
Tray Table Placement CCD (5MP) |
|
Bottom Side CCD (5MP) |
|
Run Speeds |
4 ~ 12k/hr. (Variable Package Size) |