P

roduct

C

ontent

HOME PRODUCTSProduct Content

Pick & Place Equipment (MT-DPPB-16)

Configuration

Wafer ==> CCD ==> Tray Output

Dimension

LxWxH1860mm x 1200mm x 1930mm

Applicable Packages

Die 40~120mil

Wafer Table Input &    Pickup Tolerances

6 Inch (DTF 2-6-1 Metal Frames)

θ: +/- 3°

T&R Station Auto Adjustment

+/-30um

CCD Systems

Wafer Table Pickup CCD (5MP)

Tray Table Placement CCD (5MP)

Bottom Side CCD (5MP)

Run Speed

≧20k/hr. (Variable Package Size)

TOP