Configuration |
Wafer ==> CCD ==> Tray Output |
Dimension |
LxWxH:1860mm x 1200mm x 1930mm |
Applicable Packages |
Die 40~120mil |
Wafer Table Input & Pickup Tolerances |
6 Inch (DTF 2-6-1 Metal Frames) |
θ: +/- 3° |
|
T&R Station Auto Adjustment |
+/-30um |
CCD Systems |
Wafer Table Pickup CCD (5MP) |
Tray Table Placement CCD (5MP) |
|
Bottom Side CCD (5MP) |
|
Run Speed |
≧20k/hr. (Variable Package Size) |