Configuration |
6”Wafer ==> Electric Test ==> Sorting |
Dimensions |
LxWxH:1200mm x 700mm x 1500mm |
Applicable Packages |
Die 30~220mil |
Wafer Table Input & Pickup Tolerances |
6 Inch (DTF 2-6-1 Metal Frames) |
θ: +/- 3° |
|
Electric Test System |
1 Test Station (4 Contacts, 2 on top & bottom) |
Sorting Boxes |
1~7 Boxes (Bin 1 ~ Bin 7) |
CCD Systems |
Wafer Table Pickup CCD (5MP) |
Run Speed |
≧15k/hr. (Variable Package Size) |